009073

C114

Category: Consumable Items
High Quality Lead Free Solder Iron Tip Soldering

04 June 2020

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Iron Tip Soldering 

C114 High Quality Lead Free Solder

Solder Wire features

  • JIS-A, MIL-RMA, IPC-ROL1 type lead free type flux cored wire solder.
  • Good wettability even if shorter heating by laser or light beam.
  • Support low Ag Alloy, and has excellent wettability the same as Sn-Ag3-Cu0.5 alloy.
  • Low flux spatteringduringt soldering.
  • Colorless flux residue.

A. Test items for some features

  1. Wettability test by using a through hole type PCB.
  2. Flux spattering test at Iron soldering.
  3. Fume test

B. Test results for basic characteristics

  1. Halide activator content test
  2. Flux solution resistivity test
  3. Copper plate corrosion test
  4. Copper mirror conrrosion test
  5. Surface insulation resistance test
  6. Electrochemical migration test

 

Specification

Table. Characteristics of "ASW-C114 series"

* Halide content is calculated Br to CI. CI is not contained.

 

A. Confirmation test result for special features

1. Solderbility and flux spattering test by light beam

Test method

Connectors shall be soldered on a test board by light bean soldering device, made by the Matsushita Welding Systems Co.,Ltd, BH2000. Solderbility and flux spattering on the lens shall be checked. Wetting ratio shall be calcutaled by the wetting area as per the below equation.

Wetting ratio = Wetting area / Land area x 100

Test Condition

Test board : Cu、single-sided       Borad meterial : Gless epoxy       Leans : High condenser lens

Beam power : 40W       Diameter of light focus : 2mm       Diameter of solder : 0.8mm       Preheating 0.05s

Solder feeding speed : 7mm/s       Soldering time : 1.6s       Heating after soldering : 0.3 s

Test result                        Table  Test resultASW-C114 series has good wettability and little flux spattering.

 

2. Flux Spattering test for Iron tip soldering

Test method

Place thermal paper on the device as follows. Carry 1m solder rapidly to the top of iron tip. 

The device feeds solder wire, first 7mm forward and reverse 2mm at the speed of 10mm/sec. So 5mm of solder wire will be at one time. Spattering flux can be detected on the thermal paper.

 

(Condition)       Tip : 3.2mm Flat type

                         Diameter : φ0.8mm   Iron temp.:380℃    Feeder:Our product   Numbers of shots:200

Fig. Test Situation

Test result                    Table. Test result

ASW-C11I has little flux spattering.

 

3. Flux residue color test

Test method

The flux cored solder wire shall be prepared bu 0.30±0.03g, formed to spiral shape and put at the center of
ceramic plate. The solder is melted bu floating on a solder bath set to 270and maintained until the
solder has melted. After that, flux residue color shall be checked.

Test result                                                                    Table. Test result

 

B. Test result for basic characteristics (Test sample: ASW01-C114-30)
1. Halide activator content

Test method

After preparing the flux bu 5.0±0.1g, it shall be put into 300ml beaker and then 2-propanol bu 200ml shall
be added to them. Theu shall be dissolced bu stirring at room temperature. Stirring them stronglu bu using
the magnetic stirrer, theu shall be titrated bu using the electric titration equipment with silcer nitrate standard
solution.

Criteria

Halide acticator content shall be 0.10~0.1I(%) .

Test result

2. Flux solution resistivty test

Test method

0.100±0.005ml test flux solution (toluene solution including flux by 25%) and 50ml ion exchanged water shall be put into a 50ml beaker. They shall be coiled for 60s on a hot plate, cooled down by flowing water and put into the water bath adjusted 20±2. After they reach thermal equilibrium, they shall be measured in resistivity by a conductivity meter.

Ceriteria

Resistivity shall be more than 1000Ωm.

Test result

Table. Flux solution resistivity

 

3. Copper plate corrosion

Test method

A 3mm depth hole shall be made at the center of copper plate by using a steel sphere of 20mm diameter.

After pre-heating the copper plate, the resin cored solder shall ne provided to the 3mm depth hole and melted. After that, the copper plate shall be put into the chamber which is adjusted to 40±2℃,90~95% and kept in this condition for 96 hours later, the copper plate shall be removed from the  chamber and a suitable solvent, the corrosion condition under flux residue shall be observed.

Criteria

Corrosion was not found.

Test result                                                          Table. Copper plate corrosion

4. Copper mirror corrosion

Test method

The test flux and standard rosin (2-propanol solution including flux by 25%) shall be made. 0.05ml of each test solution shall be dropped on a copper mirror teat plate. The test copper mirror plate shall be kept in a chamber adjusted 25±2℃, 50±5% for 24 hours. 24 hours later, each flux on the test plate shall be removed by 2-propanol. Corrosion shall be checked.

Criteria

Corrosion shall be not found, in comparison with standard rosin. The black surface confirms no corrosion.

Test result

Table. Copper mirror corrosion

 

 

5. Surface insulation resistance

Test method

The test boards specified JIS shall be coated with toluene solution including flux 25%. They shall be dried for 5 minutes in a dryer adjusted to 100℃. After that they shall be soldered by flosting for 3 seconds on solder bath adjusted to 270±3℃. Before putting them into a chamber, the initial value of surface insulation resistance shall be measured. In this case, coaxial cable shall be used for wiring between measurement pad on test board and insulation resistance meter. They shall be out into the chamber adjusted to 85℃ 85% being careful to prevent any water from dropping down on thr test pattern and 24, 96, 168, 408, 648, 840 and 1008 hours later, surface insulation resistance shall be measure applying the bias voltage DC100V.

  Test result                                                     Table Surface insulation resistance 

6. Electrochemical migration test

Test method

The test boards specified JIS shall be coated with toluene solution including flux by 25%. They shall be dried for 5 minutes in a dryer adjusted to 100℃. After that they shall be soldered by floating for 3 seconds on solder bath adjusted to 270±3℃. Before putting them into a chamber, the initial value of surface insulation resistance shall be measured. They shall be put into  the chamber adjusted to 85℃ 85% and applied DC45 to 50V being careful for a waterdrop not to drop down on the test pattern and 24, 96, 168, 408, 648, 840 and 1008 hours later, surface insulation resistance shall be measured applying the bias voltage DC100V. 1008hours later, the test boards shall be taken out from the chamber and confirmed whether there shall be any evidence of migration or not.

Test result              Table. Electrochemical migration test

Download : SDS C114

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