- Halogen free type, Sn-Ag-Cu lead free flux cored wire solder
- Not adding ang halogen, chlorine (CI) and Bromine (Br)
- Good solderability by nit only hand soldering bit also a robot, so workability in short time
A. Test items for some features
- Chlorine and bromine content by iron exchabge chromatography using a combustion chamber
- Wettability test by the robot ; line soldering
B. Basic characteristics
- Flux content
- Copper plate corrosion test
- Copper mirror coRROSION TEST
- Dryness test
- Solder spread test
- Surface insulation resistance test
- Electrochemical migration test
A. Test result for some festures
1. Chlorine and bromine content
Test method (Based on JPCA-ES01)
Chlorine and bromine content in flux shall be measured by the inron exchange chromatography usibg a combustion chamber.
Not adding any halogen compound in "ASW01-C240-40"
2. Soldering test by using through hole type PCB
Test method (our company own method)
connector is soldered to through-hole type PCB with soldering robot (Line soldering mode). Check wettability of through hole from bottom side of PCB and count the number of good wettability pads which solder spread to upper edge of connector pins.
Pass rate of pad is calculated by using following foemula,
Pass rate of pad (%) = number of pass pad / all pad (30) x 100
(Conditions) Soldering iron tip : 2mm, flat type
Temperature : 350℃ Diameter : Ø0.8mm Through hole : Cu, Ø2.0mm
Thickness : 1.6mm PCB : Glass epoxy Pre sikdering : 6mm, 10mm/s
Pre heating : 0.3s Main soldering : 10.5mm/s Iron speed : 0.5mm/s
B. Test result for basic
1. Flux content
Test method (Based on JIS Z 3197 8.4.1)
After preparing the resin cored solder by 30±1g (= W1) and cleaning it by 2-propanol, it shall be put into 100ml beaker. Also, glycerin shall be prepared by 20ml and after putting it into them, They shall be heated so as to separate flux from solder completely. After separating flux from solder, only soder shall be removed from them and solidified. After drying and cleaning it, it shall be measured in weight (=w2). The flux content shall be calculated by the following formula.
Flux content (%) = (W1-W2) x 100 / W1
Flux content shall be 4.0±0.3 (%)
2. Copper plate corrosion
Test method (Based on JIS Z 3197 8.4.1)
3mm depth hole shall be made at the center of copper plate by using steel sphere of 20mm diameter. After preyreating copper plate, the resin cored solder shall be provided to 3mm depth hole of it and melted. After that copper plate shall be put into the chamber rhich id adjusted to 40±2℃, 90~95% and kept in this condition for 96 hours. 96 hours later, copper plate shall be removed from the chamber and checked about the corrosion condition. After flux residue on copper plate shall be cleaned off by using suitable solvent, the corrosion condition under flux residue shall be checked too.
Corrosion shall not be found
3. Cipper mirror corrosion
Test method (Base on JIS Z 3197 8.4.2)
The test flux and standard rosin (2-propanol solution including flux by 25%) shall be made. 0.05ml of each test solution shall be dropped on a copper mirror test plate. The test copper mirror plate shall be kept in a chamber adjusted 25±2℃, 50±5% for 24 hours. 24 hours later, each flux on the test plate shall be removed by 2-propanol. Corrosion shall be checked.
Corrosion shall be not found, in comparison with standard rosin.
4. Dryness test
Test method (Based on JIS Z 3197 8.5.1)
3mm depth hole shall be made at the center of copper plate by using steel sphere of 20mm diameter. 1.00±0.05g the resin coredd solder shall be provide to 3mm depth hole of it and melted on the solder bath adjusted 270 ℃, and cooled down for 30 minutes at room temperature. The powder talc shall be sprinkled on the flux residue, and brushed off twice the surface of flux redisue. The viscosity of flux residue shall be evaluated by the adhesion exten of talc.
The talc shall be brushed off easily.
5. Solder spread test
Test method (Based on JIS Z 3197 184.108.40.206)
The one side of Cu plate (30x30x0.3mm) shall be polished by abrasive paper (No.1000) in alcohol and cleaned, and dried at room temperature. These plates shall be put into a dryer adjusted 150±3℃ for 1 hour to produce uniform oxidate on the plates,
Three pieces of swirled 0.30±0.03g resin flux cored of solder shall be placed at the certer of Cu plates. They shallbe melted on a solder bath adjusted the liquidus temperature + 50℃ dor 30 secounds after starting to melt, and lifted from the bath and cooled at room temperature. Flux residu shall be removed. The hight of thr spread solder shall be measured by a micromrter and calculated by the following method.
Solder spread ratio shall br more than 70%. (in case of oxidation copper plate)
6. Surface insulation resistance
Test method (Base on JIS Z 3197 8.5.3)
The test boards specified JIS shall be coated with 2-propanol solution including flux by 25%. They shall be dried for 5 minutes in a dryer adjusted in 100 ℃. After that they shall be soldered by floating for 3 secounds on solder bath adjusted to 270±3℃. Before putting them into a chamber, the initial value of surface insulation resistance shall be measured. In this case, coaxial cable shall be used for wiring between measurement pad on test board and insulation resistance meter. Thay shall be put into the chamber adjusted to 85℃ 85% being careful for a waterdrop not to drop down on the test pattern and 24, 96, 168, 408, 648, 840 and 1008 hours later, surface insulation resistance shall be measured applying the bias voltage DC100V.
7. Electrochemical migration test
Test method (Based on JIS Z 3197 8.5.4)
The test boards specified JIS shall be coated with 2-propanol solution inculding flux by 25%. They shall be dried for 5 minuted in a dryer adjusted to 100℃. After that they shall be soldered by floating for 3 seconds on solder bath adjusted to 270±3℃. Before putting them into a chamber, the initial value of surface insulation resistance shall be measured. They shall be put into the chamber adjusted to 85℃ 85% and applied DC45 to 50V being careful for a waterdrop not to drop down on the test pattern and 24, 96, 168, 408, 648, 840 and 1008 hours later, surface insulation resistance shall be measured applying the bias voltage DC100V. 1008 hours later, the test boards shall be take out from the cahmber and confirmed whether there shall be any evidence of migration or not.
Download : MSDS C240