C240

Category: Consumable Items
Lead Free Solder Wire Zero Halogen

28 September 2020

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Some features

  • Halogen free type, Sn-Ag-Cu lead free flux cored wire solder
  • Not adding ang halogen, chlorine (CI) and Bromine (Br)
  • Good solderability by nit only hand soldering bit also a robot, so workability in short time

Test items

A. Test items for some features

  1. Chlorine and bromine content by iron exchabge chromatography using a combustion chamber
  2. Wettability test by the robot ; line soldering

 

B. Basic characteristics

  1. Flux content
  2. Copper plate corrosion test
  3. Copper mirror coRROSION TEST
  4. Dryness test
  5. Solder spread test
  6. Surface insulation resistance test
  7. Electrochemical migration test

 A. Test result for some festures

1. Chlorine and bromine content 

Test method (Based on JPCA-ES01)

Chlorine and bromine content in flux shall be measured by the inron exchange chromatography usibg a combustion chamber.

Test result

Not adding any halogen compound in "ASW01-C240-40"

 

2. Soldering test by using through hole type PCB

Test method (our company own method)

connector is soldered to through-hole type PCB with soldering robot (Line soldering mode). Check wettability of through hole from bottom side of PCB and count the number of good wettability pads which solder spread to upper edge of connector pins.

  Pass rate of pad is calculated by using following foemula,

   Pass rate of pad (%) = number of pass pad / all pad (30) x 100

(Conditions)       Soldering iron tip : 2mm, flat type

                           Temperature : 350℃     Diameter : Ø0.8mm     Through hole : Cu, Ø2.0mm

                           Thickness : 1.6mm     PCB : Glass epoxy     Pre sikdering : 6mm, 10mm/s

                           Pre heating : 0.3s     Main soldering : 10.5mm/s     Iron speed : 0.5mm/s

B. Test result for basic 

1. Flux content 

Test method (Based on JIS Z 3197 8.4.1)

  After preparing the resin cored solder by 30±1g (= W1) and cleaning it by 2-propanol, it shall be put into 100ml beaker. Also, glycerin shall be prepared by 20ml and after putting it into them, They shall be heated so as to separate flux from solder completely. After separating flux from solder, only soder shall be removed from them and solidified. After drying and cleaning it, it shall be measured in weight (=w2). The flux content shall be calculated by the following formula. 

Flux content (%) = (W1-W2) x 100 / W1

Criteria

Flux content shall be  4.0±0.3 (%)

Test result


 

2. Copper plate corrosion 

Test method (Based on JIS Z 3197 8.4.1)

  3mm depth hole shall be made at the center of copper plate by using steel sphere of 20mm diameter. After preyreating copper plate, the resin cored solder shall be provided to 3mm depth hole of it and melted. After that copper plate shall be put into the chamber rhich id adjusted to 40±2℃, 90~95% and kept in this condition for 96 hours. 96 hours later, copper plate shall be removed from the chamber and checked about the corrosion condition. After flux residue on copper plate shall be cleaned off by using suitable solvent, the corrosion condition under flux residue shall be checked too.

Ceriteria

Corrosion shall not be found

Test result

 

3. Cipper mirror corrosion

 Test method (Base on JIS Z 3197 8.4.2)

  The test flux and standard rosin (2-propanol solution including flux by 25%) shall be made. 0.05ml of each test solution shall be dropped on a copper mirror test plate. The test copper mirror plate shall be kept in a chamber adjusted  25±2, 50±5% for 24 hours. 24 hours later, each flux on the test plate shall be removed by 2-propanol. Corrosion shall be checked.

Criteria 

Corrosion shall be not found, in comparison with standard rosin.

Test result

 

4. Dryness test

Test method (Based on JIS Z 3197 8.5.1)

  3mm depth hole shall be made at the center of copper plate by using steel sphere of 20mm diameter.  1.00±0.05g the resin coredd solder shall be provide to 3mm depth hole of it and melted on the solder bath adjusted 270 ℃, and cooled down for 30 minutes at room temperature. The powder talc shall be sprinkled on the flux residue, and brushed off twice the surface of flux redisue. The viscosity of flux residue shall  be evaluated by the adhesion exten of talc.

Criteria

The talc shall be brushed off easily.

Test result

 

5. Solder spread test

Test method (Based on JIS Z 3197 8.3.1.1)

  The one side of Cu plate (30x30x0.3mm) shall be polished by abrasive paper (No.1000) in alcohol and cleaned, and dried at room temperature. These plates shall be put into a dryer adjusted  150±3℃ for 1 hour to produce uniform oxidate on the plates, 

  Three pieces of swirled  0.30±0.03g resin flux cored of solder shall be placed at the certer of Cu plates. They shallbe melted on a solder bath adjusted the liquidus temperature + 50℃ dor 30 secounds after starting to melt, and lifted from the bath and cooled at room temperature. Flux residu shall be removed. The hight of thr spread solder shall be measured by a micromrter and calculated by the following method.

 

Criteria

Solder spread ratio shall br more than 70%. (in case of oxidation copper plate)

Test result

 

 

 

6. Surface insulation resistance

Test method (Base on JIS Z 3197 8.5.3)

  The test boards specified JIS shall be coated with 2-propanol solution including flux by 25%. They shall be dried for 5 minutes in a dryer adjusted in 100 ℃. After that they shall be soldered by floating for 3 secounds on solder bath adjusted to 270±3. Before putting them into a chamber, the initial value of surface insulation resistance shall be measured. In this case, coaxial cable shall be used for wiring between measurement pad on test board and insulation resistance meter. Thay shall be put into the chamber adjusted to 85℃ 85% being careful for a waterdrop not to drop down on the test pattern and 24, 96, 168, 408, 648, 840 and 1008 hours later, surface insulation resistance shall be measured applying the bias voltage DC100V.

 

 

 7. Electrochemical migration test

Test method (Based on JIS Z 3197 8.5.4)

  The test boards specified JIS shall be coated with 2-propanol solution inculding flux by 25%. They shall be dried for 5 minuted in a dryer adjusted to 100℃. After that they shall be soldered by floating for 3 seconds on solder bath adjusted to 270±3℃. Before putting them into a chamber, the initial value of surface insulation resistance shall be measured. They shall be put into the chamber adjusted to  85℃ 85% and applied DC45 to 50V being careful for a waterdrop not to drop down on the test pattern and 24, 96, 168, 408, 648, 840 and 1008 hours later, surface insulation resistance shall be measured applying the bias voltage DC100V. 1008 hours later, the test boards shall be take out from the cahmber and confirmed whether there shall be any evidence of migration or not.

Download : MSDS C240